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Product Detail

H31D-LV
Electrical
Electrical,
Thermal
Oven
1
28 days
10,000-15,000cPs
@ 20 rpm
≥110°C
1.6
150°C/1 hr
≥5 kg
0.89 W/mK
35 x 10-6 in/in/°C (below Tg)
N/A
N/A
85D
N/A
Electronics Assembly,
Hybrid,
Medical,
Semiconductor
Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
PCB Level Materials,
Semiconductor ,
Solder Replacement,
Wafer Level
FAQ
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    United States
    Date Event Booth Location
    2018
    02-06  to  02-08 MD&M West 725 Anaheim, CA
    03-13  to  03-15 OFC 2018 2406 San Diego, CA
    05-01  to  05-01 iMAPS New England Tabletop Boxborough, MA
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    Date Event Booth Location
    2017
    09-20  to  09-22 Display International-Touch Taiwan 2017 TBA Taipei City - Taiwan
    10-09  to  10-12 Bondexpo Stuttgart - Germany
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