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Complete List of Products

 
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Product Application Type Conductivity Cure Type Pot Life Tg Thixo Viscosity Data Sheet SDS Compare
431 Circuit / Electronic Assembly,
Electrically Conductive,
Endoscopes ,
Heat Sinking,
Hybrids Microelectronics,
PCB Level Materials,
Semiconductor
Electrical,
Thermal
Oven
med
high
N/A
high
509FM-1 Circuit / Electronic Assembly,
Fiber Optic,
Glob Top,
Hybrids Microelectronics,
Non-Conductive,
Opto-Packaging,
Potting,
Semiconductor
None
Oven,
Room Temperature
short
low
N/A
low
730 Catheter Materials,
Circuit / Electronic Assembly,
Endoscopes ,
Medical Epoxies,
Non-Conductive,
USP Class VI Approved
None
Oven,
Room Temperature
short
med
med
high
730 Black Catheter Materials,
Circuit / Electronic Assembly,
Endoscopes ,
Medical Epoxies,
Non-Conductive,
PCB Level Materials
None
Oven,
Room Temperature
short
med
med
high
730-110 Catheter Materials,
Endoscopes ,
Fiber Optic,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Potting,
Underfill
None
Oven,
Room Temperature
short
med
N/A
med
730-110 Black Catheter Materials,
Endoscopes ,
Fiber Optic,
Non-Conductive,
Opto-Packaging,
Potting
None
Oven,
Room Temperature
short
med
N/A
med
731 Circuit / Electronic Assembly,
Non-Conductive,
Semiconductor
None
Oven,
Room Temperature
short
med
N/A
high
920 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven,
Snap
med
med
med
med
920-FL Circuit / Electronic Assembly,
Hybrids Microelectronics,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven,
Snap
med
med
med
med
921 Circuit / Electronic Assembly,
Hybrids Microelectronics,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven,
Snap
med
med
med
med
921-FL Circuit / Electronic Assembly,
Hybrids Microelectronics,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven,
Snap
med
med
med
med
930 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
PCB Level Materials
Thermal
Oven
med
med
N/A
high
930-1 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Non-Conductive,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor
Thermal
Oven
long
med
med
high
930-4 Circuit / Electronic Assembly,
Fiber Optic,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Non-Conductive,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solar
Thermal
Oven
long
med
med
med
AP-100 Endoscopes ,
Fiber Optic,
Optical Materials,
Opto-Packaging
None
N/A
N/A
N/A
N/A
low
B1118-LH Circuit / Electronic Assembly,
Fiber Optic,
Non-Conductive,
Optical Materials,
PCB Level Materials
Thermal
Oven
long
med
med
high
B9021 Circuit / Electronic Assembly,
Hybrids Microelectronics,
Non-Conductive,
Opto-Packaging,
PCB Level Materials
None
Oven
days
med
med
med
B9021-14 Heat Sinking,
LCDs
Thermal
Oven
long
low
med
med
B9021-15 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
Non-Conductive,
Opto-Packaging,
PCB Level Materials,
Semiconductor ,
Wafer Level
Thermal
Oven
days
high
high
high
B9101-2 Unfilled Circuit / Electronic Assembly,
Fiber Optic,
Hybrids Microelectronics,
Non-Conductive,
Opto-Packaging,
Underfill,
Wafer Level
None
Oven
days
med
N/A
low
B9126-7 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Non-Conductive,
Opto-Packaging,
Packaging Materials,
PCB Level Materials
Thermal
Oven,
Snap
days
med
med
high
B9126-8 Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Opto-Packaging,
PCB Level Materials
Electrical,
Thermal
Oven,
Snap
days
med
med
med
B9144 Catheter Materials,
Circuit / Electronic Assembly,
Endoscopes ,
Fiber Optic,
Hybrids Microelectronics,
Medical Epoxies,
Non-Conductive,
Opto-Packaging,
PCB Level Materials,
Potting,
Semiconductor ,
Wafer Level
None
Oven,
Room Temperature
quick
low
N/A
low
CF6-2 Endoscopes ,
Fiber Optic,
Hybrids Microelectronics,
Medical Epoxies,
Non-Conductive,
Optical Materials,
Potting
None
Oven
long
high
N/A
low
E2036 Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement
Electrical,
Thermal
Oven
days
low
med
med
Compare Products
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  1. FAQs

  2. USA Tradeshows

    USA Tradeshows

    United States
    Date Event Booth Location
    2018
    02-06  to  02-08 MD&M West 725 Anaheim, CA
    03-13  to  03-15 OFC 2018 2406 San Diego, CA
    05-01  to  05-01 iMAPS New England Tabletop Boxborough, MA
    06-12  to  06-14 International Microwave Symposium 2132 Philadelphia, PA
    07-10  to  07-12 Semicon West 5969 San Francisco, CA
  3. GLOBAL Tradeshows

    International Tradeshows

    China
    France
    Germany
    India
    Italy
    Japan
    Korea
    Malaysia
    Philippines
    Singapore
    Spain
    Switzerland
    Taiwan
    Thailand
    Turkey
    UK
    Vietnam
    Date Event Booth Location
    2017
    09-20  to  09-22 Display International-Touch Taiwan 2017 TBA Taipei City - Taiwan
    10-09  to  10-12 Bondexpo Stuttgart - Germany
    11-03  to  11-05 Optics Valley of China International OptoElectronic Exposition and Forum (OVC) Wuhan, China - China
    11-14  to  11-17 SEMICON Europa B1/1823 Munich - Germany
    11-14  to  11-17 Productronica A4/n.a. Munich - Germany
    12-6  to  12-8 International Printed Circuit & APEX South China Fair Shenzen - China
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