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Complete List of Products

 
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Product Application Type Conductivity Cure Type Pot Life Tg Thixo Viscosity Data Sheet SDS Compare
H70E-175 Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor
Thermal
Oven
days
med
med
med
H70E-2 Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor
Thermal
Oven
days
med
med
med
H70E-2 Unpigmented Circuit / Electronic Assembly,
Glob Top,
Hybrids Microelectronics,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Wafer Level
Thermal
Oven,
Snap
days
med
low
med
H70E-2LC Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven
days
med
high
med
H70E-4 Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven,
Snap
days
med
med
high
H70E-TI Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven
days
med
med
med
H70E-TI-LH Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven
days
med
med
med
H70S Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven,
Snap
days
med
med
low
H72 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor
Thermal
Oven,
Snap
med
high
low
med
H73 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
PCB Level Materials,
Semiconductor
Thermal
Oven
med
high
N/A
high
H74 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
PCB Level Materials,
Semiconductor
Thermal
Oven,
Snap
med
high
med
high
H74-110 Fiber Optic,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Potting,
Semiconductor
None
Oven,
Snap
short
high
N/A
med
H74F Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor
Thermal
Oven,
Snap
med
med
med
high
H74G Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Wafer Level
Thermal
Oven
quick
high
low
high
H75 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor
Thermal
Oven,
Snap
med
high
N/A
high
H77 Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven
med
med
low
med
H77 Black Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor
Thermal
Oven
med
med
med
med
H77S Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor ,
Underfill
Thermal
Oven
med
med
low
med
H77T Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
PCB Level Materials
Thermal
Oven
med
med
med
med
H81 Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Semiconductor
Electrical,
Thermal
Oven
days
high
N/A
high
H81A Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Semiconductor
Electrical,
Thermal
Oven
days
high
N/A
high
HYB-353ND Fiber Optic,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials
None
Oven,
UV Light
med
med
N/A
med
HYB-353ND-HV Fiber Optic,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials
None
Oven,
UV Light
med
med
N/A
high
HYB-353ND-LV Fiber Optic,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials
None
Oven,
UV Light
long
med
N/A
low
HYB-353ND-TX2 Fiber Optic,
Non-Conductive,
Optical Materials,
Opto-Packaging,
Packaging Materials
None
Oven,
UV Light
days
med
med
high
Compare Products
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  2. USA Tradeshows

    USA Tradeshows

    United States
    Date Event Booth Location
    2018
    02-06  to  02-08 MD&M West 725 Anaheim, CA
    03-13  to  03-15 OFC 2018 2406 San Diego, CA
    05-01  to  05-01 iMAPS New England Tabletop Boxborough, MA
    06-12  to  06-14 International Microwave Symposium 2132 Philadelphia, PA
    07-10  to  07-12 Semicon West 5969 San Francisco, CA
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    International Tradeshows

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    Switzerland
    Taiwan
    Thailand
    Turkey
    UK
    Vietnam
    Date Event Booth Location
    2018
    01-31  to  02-02 SEMICON Korea C762 Seoul - Korea
    03-14  to  03-15 LOPEC B0/403 Munich - Germany
    03-14  to  03-16 Electronica China 2018 E1 1012 Shanghai, China - China
    03-15  to  03-15 Power Electronics & Battery B2 Telford, West Midlands UK - UK
    03-15  to  03-18 West China Aerospace & Military Industry Exhibition C18-3 Xi'an City, Shaaxi Province, PRC - China
    03-22  to  03-22 BAM St. Hallle, Switzerland - Germany
    03-22  to  03-24 MECSPE Hall 6 Parma, Italy -
    04-25  to  04-26 CAM Halle - Germany
    05-15  to  05-17 OPTATEC Hall 3.0 Frankfurt - Germany
    05-15  to  05-18 Joining Technology A07:31 Jönköping, Sweden -
    06-21  to  06-24 Medicare Taiwan 2018 TBA Taipei City, Taiwan - Taiwan
    07-4  to  07-5 UK Semiconductors TBA Sheffield - UK
    08-29  to  08-31 Touch & Display Taiwan 2018 TBA Taipei City, Taiwan - Taiwan
    09-05  to  09-08 China International Optoelectronic Expo (CIOE) TBA Shenzhen - China
    09-25  to  09-28 Micronora TBA Besançon, France - France
    10-08  to  10-11 Bondexpo Stuttgart - Germany
    10-23  to  10-26 GLASSTEC Düsseldorf - Germany
    10-30  to  11-01 Advanced Engineering TBA NEC Birmingham - UK
    11-13  to  11-16 SEMICON Europa A4/161 München - Germany
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