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Epoxy Technology Introduces New EPO-TEK® TD1001 Adhesive for Ferrite Bonding and Substrate Applications

(Billerica, MA) – October 24, 2008 - Epoxy Technology, Inc. a leader in developing electrically and thermally conductive adhesives is launching a new product, EPO-TEK® TD1001, designed for ferrite bonding and substrate attach applications. This advanced adhesive is suited for use in low stress applications, such as Multi-Chip Modules (MCM’s) and die stacking.


As a high-performance flexible adhesive, TD1001 was engineered to provide robust mechanical and thermal properties. Specifically, TD1001 offers proven performance when subjected to the following tests:

  • 100 cycles -65°C to 150°C liquid to liquid thermal shock ---with no signs of delamination or cracking.
  • 1000 hours thermal aging at 150°C ---with no signs of delamination or cracking.
  • Easily withstands 3 x 250°C reflow cycles ---with no signs of delamination or cracking.

Formulated as a single component system with a 28 day pot life, TD1001 was designed to reduce processing steps, helping customers realize greater manufacturing efficiencies.


Mavyn Holman, R&D Director, Epoxy Technology, said “Epoxy Technology understands its customers’ needs and uses its research capabilities and technical expertise to create innovative products to meet or exceed our customers’ high-performance requirements.”


For more information on the EPO-TEK TD1001 or any of Epoxy Technology products, please visit our website at: www.EPOTEK.com. Contact a member of our technical sales or customer service team at 800-227-2201.


About Epoxy Technology

Epoxy Technology, Inc., founded in 1966, is a pioneer in the development of specialty epoxies and polymers that meet the highest performance standards for high tech industries worldwide. Through product innovation, EPO-TEK continues to keep pace with evolving industries including semiconductor and microelectronics, medical devices, optical and aerospace. EPO-TEK is a registered trademark of Epoxy Technology, Inc.

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