Epoxy Technology was founded in 1966 as the world’s first supplier of electrically conductive epoxies for use as die-attach adhesives in hybrid microelectronics, semiconductor packaging and assembly. Chemical engineer Frank W. Kulesza, our President, first formulated these precious-metal-filled materials as a consultant for IBM.

Since then the growth of Epoxy Technology has been fueled by the rising use of die-attach epoxies. But our expertise in manipulating epoxy compounds has also resulted in a continual broadening of our product line over the years. For a complete product listing, you can browse our catalog. In addition to our comprehensive family of materials for the semiconductor and hybrid fields, we now offer products suited for a wide array of applications in fiber optics, optoelectronics, medical devices, and solder replacement.

During recent years, our continuing commitment to develop innovative adhesive and coating technology for high-tech manufacturers has resulted in the patented polymer flip chip (PFC®) technology, as well as numerous new materials optimized for uses in the industries we serve. Visit the Self Service Center for a product recommendation that is well suited to your unique application.